March 13, 2018 - ON Semiconductor (ON Semiconductor, NASDAQ: ON), which promotes energy-efficient innovation, announces the X-Class image sensor platform, enabling a single camera design to support multiple product resolutions It also supports different pixel functions. The first two devices on the new platform are 12 megapixel (MP) XGS 12000 and 4k / Ultra High Definition (UHD) resolution XGS 8000 image sensors that provide high performance imaging for applications such as machine vision, intelligent transportation systems and broadcast imaging. .
The X-Class image sensor platform enables a new dimension in camera design by supporting multiple CMOS pixel architectures within the same image sensor framework. This allows a single camera design to support multiple product resolutions, as well as support for different pixel functions, such as larger pixels with higher resolution for higher resolution in a given optical format, and optimized design for low noise operation. To increase the dynamic range and so on. Supporting different pixel architectures through a common high-bandwidth, low-power interface allows camera manufacturers to leverage existing parts inventory and accelerate time-to-market for new camera designs.
The first two devices in the X-Class family, the XGS 12000 and XGS 8000, are based on the platform's first pixel architecture, the advanced 3.2 um global shutter CMOS pixel for superior imaging performance, high image uniformity and low noise. characteristic. The XGS 12000 delivers 12 megapixels (4096 x 3072 pixels) in 1-inch optical format, providing the imaging detail and performance needed for modern machine vision and inspection applications. The device will offer two speed grades: one that leverages the 10GigE interface by providing full resolution speeds of up to 90 frames per second (fps); the other lower price version offers 27 fps at full resolution, with The available bandwidth of the USB 3.0 computer interface remains the same. The XGS 8000 offers 4k/UHD (4096 x 2160 pixels) resolution in 1/1.1-inch optical format, and is planned to offer two speed grades (130 and 75 fps), making this device ideal for broadcast applications.
Both devices are packaged in a low-profile, low-voltage, low-power architecture with an X-Class interface that is fully compatible with the compact 29 x 29 mm2 camera design.
Herb Erhardt, vice president and general manager of the Industrial Solutions Division of the Image Sensors Division at ON Semiconductor, said: "As the demand for industrial imaging applications such as machine vision inspection and industrial automation continues to advance, the design and performance of image sensors for this growing market It must also evolve. Our new XGS pixel X-Class platform and devices enable end users to get the performance and imaging capabilities they need in these applications, while camera manufacturers are also flexible in their current and future customers. Develop next-generation camera designs."
The XGS12000 and XGS 8000 will begin sampling in the second quarter of 2018 and are scheduled for volume production in the third quarter. Both devices are available in a 163-pin LGA package in both monochrome and color configurations. Future X-Class products will also include devices based on 3.2 um XGS pixels and products based on other pixel architectures.
To help customers develop new cameras with new image sensors, ON Semiconductor offers a suite of support for complete device evaluation, including still images, video capture and region of interest reading. Other custom test features are also configurable. Customers can contact their local ON Semiconductor sales representative to purchase an evaluation kit or inquire about a live demonstration of the X-Class device.
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