At the "3rd New Generation Lighting Technology Exhibition", PLANSEE Japan exhibited products such as molybdenum (Mo) substrates and molybdenum-copper (MoCu) substrates for replacing sapphire substrates embedded in LED structures. The heat dissipation of the LED chip can be improved, and the LED chip can be made higher in power and higher in efficiency.
According to the relevant person, the LED chip manufacturing process for replacing the substrate is to first epitaxially grow the GaN-based semiconductor crystal on the sapphire substrate, and then attach the Mo substrate or the MoCu substrate to the GaN-based semiconductor crystal. The sapphire substrate is then removed and cut into LED chips. Techniques for replacing sapphire substrates with other substrates have been used for partial blue LED chips.
However, at present, the use of Mo substrates is currently limited to UV LED chips. Mainly due to the laser dicing (Laser Dicing) method, the LED wafer replaced by the Mo substrate or the like is cut into an LED chip at a slower speed, and is not suitable for producing a blue LED chip with a large supply amount. As the technology of laser dicing continues to increase, it is possible to mass produce blue LED chips in the near future using Mo substrates.
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