TE Connectivity TE's a division circuit protection unit 9 announced a new low resistance (Low rho) surface mount device (surface-mount device, SMD) series of circuit protection devices, especially for mobile applications where space is limited. These devices offer both overcurrent and overtemperature protection for battery pack circuit protection modules in compact consumer electronics such as smart phones, MP3/4 players and portable GPS devices. This family of low-resistance surface mount devices meets the demand for flexible, low-cost, low-power solutions for the consumer-driven mobile market, making them ideal for today's compact electronics.
Handheld consumer product manufacturers demand as few devices as possible, occupying the least amount of board space and helping to reduce product costs. To meet these needs, these low-resistance surface mount devices are available in 1210 (3.0mm × 2.54mm or 0.12in × 0.10in), 1206 (3.0mm × 1.52mm or 0.12in × 0.060in) or 1812 (3.0mm × 4.57mm) Or 0.12in x 0.18in) The industry standard form factor provides low resistance to meet board space requirements. In addition, these devices can be assembled using reflow soldering technology, which saves board space and reduces production costs compared to the spot welding process required by many other devices.
These low-resistance surface mount devices have a resistance of only 10 to 25mΩ after reflow soldering, and low impedance helps reduce power consumption and improve battery efficiency. Nine new devices in the low-resistance surface mount device family are designed for 2A and above operating currents.
"In general, the new low-resistance surface mount device family offers a high degree of flexibility and choice for manufacturers who need to meet today's wide range of product size design requirements," said Xu Zhifeng, product manager for TE Circuit Protection S. Battery pack suppliers are particularly concerned with improving and expanding existing products, and low-resistance surface mount device devices will help them achieve their design goals and simplify installation methods."
The new series of device models are:
microSMD190LR-2
microSMD200LR-2
microSMD250LR-2
microSMD350LR-2
nanoSMD175LR-2
nanoSMD200LR-2
nanoSMD270LR-2
nanoSMD350LR-2
miniSMDC350LR-2
The "micro" prefix refers to the 1210 form factor; the "nano" prefix refers to the 1206 form factor; the "mini" prefix refers to the 1812 form factor, which has an R1max of 10 to 25 mΩ. In response to market trends towards more compact electronic products, TE Circuit Protection will continue to enhance its family of low-resistance surface mount devices.
Price: order 100,000, each $0.15 supply: spot delivery: within 8 weeks after receiving the order
Square Hole Breadboard,400 Tie Point Breadboard,Makeronics Breadboard,Small Solderless Breadboard
Cixi Zhongyi Electronics Factory , https://www.cx-zhongyi.com