Molex provides socket components for second-generation Intel Core CPUs

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Molex , the world's leading provider of complete interconnect products, now offers a contact array package (Land Grid Array, LGA) 1155 Intel CPU socket assembly . The LGA 1155 CPU socket, also known as the Socket H2 socket, is designed for Intel's second-generation Core i7/i5/i3 series of desktop microprocessors, codenamed Sandy Bridge. This 1155 circuit socket is an alternative to the LGA 1156 (or Socket H1) socket for Nehalem processors.

Carol Liang, Product Manager, Molex's Commercial Products Division, said: "Intel's second-generation Core microprocessors use 32-nm microarchitecture technology to deliver breakthrough performance. Molex leverages interconnect engineering expertise to support this market-leading performance. We offer rigorously tested, precision-designed, high-reliability socket assemblies that support Intel Core i7/i5/i3 processors for desktops, servers and workstations."

The LGA 1155 and LGA 1156 sockets have several features in common, such as 0.9144 mm (0.036 in) pitch, I/O, power and ground contacts for processor mating, and one with 24 x 16 grid over-s Grid depopulation) 40 x 40 grid array with contacts placed in the array in two opposite L forms to maintain electrical contact under processor load conditions.

Moreover, the two sockets use high-strength copper alloys as substrate contact materials to ensure reliable physical contact with their respective LGA contact packages, which are designed to withstand typical reflow conditions. There are lead-free solder balls on the bottom of the two sockets for surface mounting on the motherboard. An Independent Loading Mechanism (ILM) can be shared with each of the two sockets and attached to the PCB via a substrate to provide the pressure required to mount the processor to the socket and through the socket solder joints The resulting pressure load is evenly distributed.

The sockets used by the LGA1155 and LGA1156 based processors are not compatible due to differences in electrical, mechanical, and keying. However, the two sockets feature a similar three-piece design that includes sockets, ILMs, and substrates to ensure easy transfer of useful socket features and benefits from a generation of sockets to next-generation sockets.

Molex's latest LGA 1155 socket assemblies (47596-0232 and 47596-0233) and the new LGA 1156 expansion products (47596-0532 and 47596-0533) are available in 15 and 30 micron gold-plated contacts. These sockets feature a universal alignment key of 2.10 mm (0.083 in) to accommodate the optional ILM pick-and-place top cover.

Other new socket components added to the 47596 series are the LGA 1155 and LGA1156 flat and shoulder screws for 1U servers. These components are available in 5.60 mm (0.220") and 4.22 mm (0.166") thread sizes, respectively, and are lead free.