New 3D Semiconductor Bonding Material Creates "Silicone Building"

Recently, 3M and IBM announced that they will jointly develop a new type of bonding material used to package semiconductors into dense towers of stacked silicon "towers." The goal of the two companies is to create a new type of material. With it, it was possible to combine 100 independent silicon chips into a commercial microprocessor.

This laminated silicon wafer will significantly increase the level of integration of information technology products and consumer electronics products. For example, the processor, memory, and network elements can be packaged together into "silicon blocks" in this way, creating a computer chip 1,000 times faster than the current fastest microprocessor, enabling smartphones, tablets, and computers. Computers and gaming devices are more powerful.

The two companies are likely to make a leap forward in the industry's current pursuit of vertical stacking of silicon wafers (ie, 3D packaging). This joint research and development will solve some of the most difficult problems that affect the substantial progress of 3D silicon packaging. For example, the adhesives they are developing must enable heat transfer between densely stacked silicon wafers to dissipate heat from thermal devices such as logic circuits.

"Now the chips, including those with 3D transistors, are actually 2D chips, using a planar structure," said Bernard Meyerson, vice president of R&D at IBM. "Our scientists are working on new materials and will be extremely The powerful computing power is integrated into a brand-new package form, namely 'silicon chip building'. I believe we will create the latest technology level of silicon package, develop a faster, more powerful and more energy-efficient. Low new semiconductors, which are urgently needed by many manufacturers, especially tablet computers and smart phone manufacturers."

Designed to Bond All Silicon Wafers Today, many types of semiconductors, including semiconductors for servers and game consoles, are in dire need of single-wafer special packaging and bonding technologies and methods. 3M and IBM will develop new adhesives that can bond thousands of wafers together at once. The process of bonding wafers is like sticking wafers with icing sugar.

Under the cooperation agreement, IBM will use its expertise to formulate a unique semiconductor packaging process; 3M will use its expertise to develop and produce adhesive materials.

“3M hopes to work with IBM, a pioneer in the new generation semiconductor packaging industry, to bring their expertise and industry experience to work and use,” said Herve Gindre, vice president of 3M Electronics Market Materials, “3M has been working with IBM for many years. This cooperation will bring the relationship between the two companies to a new level. We are very excited to be one of the developers of innovative 3D packaging.”

Adhesives are one of 3M's 46 core technology platforms. 3M's adhesives are exquisitely crafted to meet the needs of customers and are widely used in high-tech fields including semiconductors, consumer electronics, aerospace and solar energy. Many products and industries.