In recent years, LED package formats have evolved from in-line DIP packages to TOP SMD packages to integrated COB packages and wafer-level CSP packages. With the deepening of high-power LEDs in semiconductor lighting applications, LED packaging technology is becoming more and more powerful and integrated.
At present, SMD patch is still the mainstream in the LED industry. COB light source has advantages in the LED commercial photo segment, whether it is SMD patch, COB light source or CSP (chip scale package) technology. Development space. It can be seen that the development of technology is a long way to go. If a packaging enterprise wants to be eliminated from extrusion in this field, it must inevitably increase its capacity for scale production and technological innovation.
For LED package products, packaging materials and package structures are the main factors affecting their performance. Since entering the field of high-power LED light source in 2008, Liyang has undergone continuous performance improvement and technological innovation, from the earliest 1-3W imitation lumen lamp beads to SMD3030 lamp beads to today's flip-chip FE30/FE35 lamps. Beads, the wafers of the products are getting smaller and smaller, the reliability is getting better and better, the weather resistance is getting stronger and stronger, and the cost performance is getting higher and higher. The achievements in the field of LED packaging have been unanimously affirmed in the industry. It has won the honorary title of the annual top 100 LED application companies for two consecutive years and ranked 65th in the list of potential companies in Forbes China's non-listed companies.
The flip-chip products of Liyang have been widely used in automotive lighting, outdoor lighting and other fields, and the prospects are promising. In the near future, it will replace traditional LED light source products in a wide range of fields such as aeronautical communication, commercial and residential lighting, urban lighting engineering, and road lighting.
Qin Shengyu, executive deputy general manager of Liyang Optoelectronics, said: "Liyang Optoelectronics maintains strong R&D capabilities, adheres to independent technological innovation, and recognizes that product quality is the lifeline of the company's foothold, does not participate in price vicious competition, and insists on a cost-effective product line; Actively introduce automated production lines, and adhere to independent research and development production from industrial chain components such as light source, lens and heat dissipation, ensuring high quality and high cost performance of products, which has been unanimously recognized by domestic and foreign customers. In the future, Liyang Optoelectronics will continue to enhance its own brands. The R&D strength has made the company bigger and stronger, and has become a respected Chinese national brand enterprise."
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